Senior Process Engineer Chemical Processes for Advanced Semiconductor Packaging (SiPFAB) / Prosessi-insinööri (SiPFAB)

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Tampere University System-in-Package Fabrication (SiPFAB) is now looking for a Senior Process Engineer.

System-in-Package Fabrication (SiPFAB) is a new infrastructure being established at the Faculty of Information Technology and Communication Sciences (ITC) of Tampere University. Located on the Hervanta campus, SiPFAB focuses on chip packaging, integration, and testing. The pilot line provides a unique environment for combining and testing Wide Bandgap (WBG) chips and various semiconductor components as complete system solutions.

SiPFAB enables the development and experimentation of future-oriented, environmentally friendly, and customized packaged chip systems. The infrastructure supports research and pilot-scale development of emerging chip technologies that drive energy-efficient solutions for applications in industry, transportation, and energy systems.

The pilot line is industry oriented. SiPFAB offers research and development services, piloting opportunities, and expert support across all stages of chip integration and packaging from concept to prototype and pre-production.

SiPFAB is part of the Chips JU Wide Band Gap Pilot Line, which contributes to the European objective of strengthening the semiconductor technology and manufacturing ecosystem.

WBG Pilot Line infrastructures

The national nodes of the WBG Pilot line will host different cleanroom facilities enabling the transition from research to industrial-scale production in the WBG and Ultra-WBG semiconductor technologies, consolidating Europe's autonomy in the semiconductor sector.
Read more about the WBG Pilot Line

JOB DESCRIPTION

As a Senior Process Engineer specializing in wet processes for nextgeneration semiconductor packaging, you will lead the development of processes such as electroplating, cleaning, and etching within our pilotline environment. Working as part of a multidisciplinary team, you will contribute directly to customer projects spanning academia, research institutes, and industry driving the demonstration, maturation, and commercialization of advanced packaging technologies.

In this role, you will also play a key part in process control, tool procurement, safety, user training, and equipment lifecycle management, ensuring a robust and scalable process foundation for SiPFAB.

Your Key Responsibilities

You will take ownership of:

• Establishing, developing, and optimizing chemical processes for semiconductor applications.
• Actively contributing to ongoing and future R&D and customer projects
• Engaging and collaborating with academic, RTO, and industrial partners
• Selecting, specifying, and procuring process tools and equipment
• Overseeing tool installation, qualification, and maintenance activities
• Conducting rootcause analysis, troubleshooting yield or process issues, and driving corrective actions
• Working closely with equipment vendors and material suppliers to advance process capability
• Ensuring process documentation, safety compliance, and user training within the pilotline environment

REQUIREMENTS

You are a proactive engineer who enjoys handson experimentation, problem solving, and working in an evolving cleanroom environment.

Required Skills & Experience

• M.Sc. or Ph.D. in an applicable field such as Materials Science, Chemistry, Semiconductor Technology
• at least 3-5 years of relevant experience
• Proven experience in etching, electroplating, or cleaning processes
• Understanding of chemical safety, safety protocols, and chemical handling
• A strong, structured approach to problem solving and troubleshooting
• Hands-on mindset and comfort working directly with process tools
• Ability to work effectively in conditions of ambiguity where processes and tools are still evolving
• Strong communication and collaboration skills for working with internal teams and external partners
• High attention to detail and process discipline
• Fluent spoken and written skills in English

Considered as an asset

• Experience in the semiconductor or microelectronics industry
• Background in pilot-line environments or lab-to-production transitions
• Familiarity with process development and control methodologies (DOE, SPC etc.)
• Interest in following and understanding trends in the semiconductor packaging industry
• Knowledge of the Finnish language

Tampere University is a unique, multidisciplinary and boldly forward-looking, evolving community. Our values are openness, diversity, responsibility, courage, critical thinking, erudition, and learner-centeredness. We expect you to embrace these values and promote them in your work.

WE OFFER

At SiPFAB, you will be working at the forefront of European semiconductor development and manufacturing initiatives. We offer a high-autonomy environment designed for proactive, self-driven engineers and opportunities for substantial impact and visibility within both the organization and wider ecosystem. In addition, we offer direct collaboration with researchers, industry partners, and the semiconductor community. This is a key role in shaping and demonstrating breakthrough packaging technologies.

As a member of staff at Tampere University, you will enjoy a range of competitive benefits, such as a flexible work schedule, good facilities for teleworking, occupational healthcare services, a variety of affordable food and drink outlets across our campuses and a personal fund to spend on sports and cultural activities in your free time. Please read more about working at Tampere University. You can also find more information about us and working and living Tampere by watching our video: Tampere Higher Education Community - our academic playground

The position will be filled on permanent basis, commencing preferably as soon